A new world of connected devices is emerging. With the Internet of Things and the Industrial Internet, we are entering an era where nearly every device on the planet will be connected to other devices, sharing information, managing remote upgrades and software updates, and interacting with people across a broad range of industries and applications.

Crossbar ReRAM can enable radical innovations in the connected device world

The network of sensor nodes used in home and building automation, smart cities, smart agriculture and farming is changing the way to monitor and control our environment. The retail industry, supply management and fleet control is already changing the way goods are being tracked and shipped around the globe. These new generations of tiny devices powered by small batteries or capable of harvesting energy from their own environment are most of their time in ultra low power sleep mode and are woke-up upon events to acquire data from sensors, process some embedded algorithms, store data in embedded memory before being able to transmit to the cloud or take actions with attached actuators.

This extensive network of connected devices will require very compact memory for storing and sharing code and information, with very low cost and power consumption. It needs to be practical for integration into devices as diverse as sensors in industrial applications and smart meters in backyards or remote locations that can withstand extreme temperatures.

In IoT applications, the available energy budget is the constraint. A 10 year lifetime on a single coin cell CR2032 dictates the acceptable average system current to operate without a battery charge. Transmitting data to the cloud is a power-hungry operation and Crossbar’s ReRAM embedded technology is enabling new use-cases where local data buffering is preferred as it reduces the frequency of data transmission to the cloud.

By eliminating the need for expensive controllers or complex memory management, Crossbar’s ReRAM solutions can enable radical innovations in the connected device world through low energy, fast non-volatile storage that can be easily integrated with logic, analog and RF onto a single chip, can operate for years without a battery charge.

Creating 3D memory chips isn't too hard. But packing the memory cells so they contain a lot of dense storage is a problem that has bedeviled chip makers for a while. Figuring out a way to create 3D structures with a lot of densely packed circuitry could result in memory chips that can store a ton of data in a very small space, enabling high-density storage with faster response times and lower power consumption. As such, it could be useful in everything from data centers to smartphones.
Dean Takahashi
Lead Writer, VentureBeat